D27 Series

Full Flip Chip Stable and Reliable

By adopting COB and full flip RGB chip, the production process eliminates the need for wire-bonding, shortens the process path, and ensures the stability and reliability of the product.

Dynamic energy saving Efficient operation

The full flip-chip and COB encapsulation technology provides excellent heat dissipation for the chip, resulting in high efficiency. When combined with a constant current driving IC, it achieves energy-saving and high-efficiency performance.

Soft Surface Light Source Pure Color Clear Image

Uniform illumination, soft and non-glaring light source, less likely to cause visual fatigue; high contrast, 3840Hz high refresh rate, providing a high-definition and delicate viewing experience.

COB Encapsulation High Protection Level

Using COB encapsulation technology, the screen surface is smooth and flat, the surface of module has an IP65 protection level, which is resistant to impact, water, moisture, and static electricity, and can be cleaned with dish cloth.

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Conference Room
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H27 PRO
X Wall V3 Series
MWALL Plus Series
CRN PCON 600
Y53 Series
E28
C27 Series
X-Wall Plus
U28 Series
D27 Series
B Series
CRN PCON 200 PRO
Ultra-wide LED Wall
QS Unified cloud platform
F27 Series
X-Wall Plus 21:9
H31 Series
N31 module
D43 Series
LED Poster
H19 PRO Series
S Series
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Conference Room
Control Center
DOOH
Commercial & Retail
Sports
Transportation
Education
H27 PRO
X Wall V3 Series
MWALL Plus Series
CRN PCON 600
Y53 Series
E28
C27 Series
X-Wall Plus
U28 Series
D27 Series
B Series
CRN PCON 200 PRO
Ultra-wide LED Wall
QS Unified cloud platform
F27 Series
X-Wall Plus 21:9
H31 Series
N31 module
D43 Series
LED Poster
H19 PRO Series
S Series
others

Product Inquiry
Project Solution
Service Support
Others